Manufacturing Analysis Semiconductor Manufacturing

To: Dr. Jean-Paul Baldwin From: Ashley Brueggeman Date: November 27, 2015 Subject: Semiconductor Manufacturing Analysis I am writing in response to Dr. Jean-Paul Baldwin’s request for an important quality analysis of the semiconductor manufacturing process. I analyzed the various parts within the hard-bake process to determine any flaws within it. Part 1 The important quality characteristic in the hard-bake is the flow width of the resist which is a measure of how much it expands due to the baking process. After building and analyzing the control charts (x-bar and R) as shown in Figure 1, I can conclude that the process shows evidence of statistical control. The engineers have done a great job in monitoring and eliminating variation to keep the process in a state of statistical control because none of the sample means fall beyond the control limits nor are any of the pattern-analysis rules for detecting the presence of any special causes of variation violated. Part 2 After the additional 5 samples of wafers being added to the control charts from part 1, the quality characteristic in the hard-bake process has been compromised because Figure 2 shows evidence of the process being out of statistical control. The evidence is apparent in Figure 2, where we can see the process go out of control on the 40th sample due to violating rule number 3 (six points in a row steadily increasing or decreasing) of the pattern-analysis rules. Then the 44th sample shows another sign ofShow MoreRelatedMeasuring Manufacturing : How The Computer And Semiconductor Industries Affect The Numbers And Perceptions Upjohn Institute Working Paper No1384 Words   |  6 PagesMeasuring Manufacturing: How the Computer and Semiconductor Industries Affect the Numbers and Perceptions Upjohn Institute Working Paper No. 14-209 Susan Houseman W.E. Upjohn Institute for Employment Research e-mail: houseman@upjohn.org Timothy J. Bartik W.E. 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